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18L HDI lead-free HASL + blind and buried vias
Material: FR-4 S1000-2M TG170 Finish treatment: lead-free HASL Copper thickness: 1/H/H/H/H/H/H/H/H/1/1/1/1/1/1/H/H/1 Impedance Controller Board
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12L HDI PCB（Serpentine trace/0.2mm BGA）
Material: FR-4 370HR TG180 Finish treatment: ENIG 2U″ Copper thickness: 1/1/1/1/1/1/1/1/1/1/1/1 Molding method: CNC + V-Cut Minimum BGA pitch: 0.2mm
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High frequency 8-layer ENIG PCB
1.6mm thick, FR4 TG170 + Ro4003 material, immersion gold surface treatment, implementing IPC class 2 standards, double-sided green solder mask
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4L Rigid - Flex PCB, Delivered with Precise Processes
ENIG, 1.6mm Board Thickness, IPC Class 2 Standard, Double - Sided Solder Mask/Legend, Full - process Control of Parameters
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6L Rigid - Flex PCB, Delivered with High Standards
Material: Rigid+Flex Finish treatment: Immersion Gold Copper thickness: 1.5/0.5/1/1/0.5/1.5 IPC class 3; Copper hole 25UM; Press-fit hole; inner layer male and female copper;
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4L rigid-flex PCB with half-hole and other processes
4-layer 1mm thick immersion gold PCB, IPC class 2 standard, precise control of panelization/process parameters
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8L High Frequency PCB 1.5mm Thickness, ENIG 2U''
Double-Sided Green Solder Mask with White Legend, Premium Metal Edge Cladding + Resin Plugged Vias, Precise Impedance Controlled, Flying Probe Tested
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2-layer Rigid-Flex PCB
Rigid-flex PCB is thin and changing in shape, RF PCB is an ideal solution for ultra -thin and ultra -light packaging. Material: Rigid+Flex Finish treatment: ENIG 2U'' Copper thickness: 1/1 IPC class 2, Solder Mask, CNC
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Multilayer PCB with Resin Plugging and Electroplating Filling
Multilayer PCB boards are suitable for complex devices with a large number of components and circuits in complex design. Material: FR4 TG150 Finish treatment: Immersion Gold Copper thickness: 1/1/1/1/1/1/1/1/1/1 IPC Class 3; Hole Copper: 25 μm;
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6L HDI 0.3mm BGA, ENIG 2U''
Material: FR-4 TG170 Finish treatment: ENIG 2U″ Copper thickness: 1/1/1/1/1/1 Via-in-Pad + Serpentine Trace Design, Flying Probe Test, IPC class 2, Copper hole 25UM
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8L HDI board + segmented gold fingers
HDI can make product design more miniaturized and meet higher electronic performance Minimum hole diameter: 0.125mm Line width: 3mil
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8L High Frequency PCB
High -frequency PCB is widely used in the communication industry and network technology fields Material: MEGTRON 6 Finish treatment: Palladium-gold (without nickel) Copper thickness: 1/1/1/1/1/1/1/1 Mechanical blind burial; Metal edging
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