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4 Layers Rigid-Flex PCB
Material: Rigid-Flex Board thickness: 1.6mm Layer count & Copper thickness: 4 layers board (2/1/1/2) Finish treatment: Immersion Gold
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6 Layers Rigid-Flex PCB, Delivered with High Standards
Finish treatment: Immersion Gold Copper thickness: 1.5/0.5/1/1/0.5/1.5 IPC class 3; Copper hole 25UM; Press-fit hole; inner layer male and female copper;
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4 Layers Rigid-Flex PCB
Material: Rigid-Flex IT-180A Board thickness: 1mm+0.1 Layer count & Copper thickness: 4 layers board (1/1/1/1) Finish treatment: Immersion Gold Hole copper thickness: 20UM
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8 Layers High Frequency PCB 1.5mm Thickness, ENIG 2U''
Double-Sided Green Solder Mask with White Legend, Premium Metal Edge Cladding + Resin Plugged Vias, Precise Impedance Controlled, Flying Probe Tested
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2 Layers Rigid-Flex PCB
Rigid-flex PCB is thin and changing in shape, RF PCB is an ideal solution for ultra -thin and ultra -light packaging. Material: Rigid+Flex Finish treatment: ENIG 2U'' Copper thickness: 1/1 IPC class 2, Solder Mask, CNC
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Multilayer PCB with Resin Plugging and Electroplating Filling
Multilayer PCB boards are suitable for complex devices with a large number of components and circuits in complex design. Material: FR4 TG150 Finish treatment: Immersion Gold Copper thickness: 1/1/1/1/1/1/1/1/1/1 IPC Class 3; Hole Copper: 25 μm;
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6 Layers HDI 0.3mm BGA, ENIG 2U''
Material: FR-4 TG170 Finish treatment: ENIG 2U″ Copper thickness: 1/1/1/1/1/1 Via-in-Pad + Serpentine Trace Design, Flying Probe Test, Copper hole 25UM
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8 Layers HDI board+segmented gold fingers
HDI can make product design more miniaturized and meet higher electronic performance Minimum hole diameter: 0.125mm Line width: 3mil
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8 Layers High Frequency PCB
High-frequency PCB is widely used in the communication industry and network technology fields Material: MEGTRON 6 Finish treatment: Palladium-gold (without nickel) Copper thickness: 1/1/1/1/1/1/1/1 Mechanical blind burial; Metal edging
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4 Layers FlexBlack Stiffeners
Flexible printed circuit boards can withstand bending, twisting and folding, and have strong adaptability for small devices. Base Material: Flex PI Surface Finishing: ENIG 2U" Copper Thickness: 35/35/35/35μm LaserVia Size: 0.1mm
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Double Sided Green Solder Mask ENIG
Multilayer PCB boards are suitable for complex devices with a large number of components and circuits in complex design. Material: FR-4 TG150 1.51mm Finish treatment: ENIG 2U'' Copper thickness: 1/H/H/H/H/H/H/H/H/H/H/1
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10 Layers HDI high-stability PCB 1.6mm thickness ENIG
HDI can make product design more miniaturized and meet higher electronic performance Material: FR-4 S1000-2M TG180 Finish treatment: Immersion Gold Copper thickness: 1/1/1/1/1/1/1/1/1/1 Surface Treatment: Immersion Gold Solder mask thickness: 25μm
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