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HDI 6 layers immersion gold（0.19mm BGA）
Material: FR-4 370HR TG180 Layer count & Structure: 6-layer board Copper thickness: 1/1/1/1/1/1 Finish treatment: Immersion Gold (Gold thickness: 3U'') Molding method: CNC + VCUT Minimum BGA pitch: 0.19mm
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18 Layers HDI lead-free HASL+blind and buried vias
Material: FR-4 S1000-2M TG170 Finish treatment: lead-free HASL Copper thickness: 1/H/H/H/H/H/H/H/H/1/1/1/1/1/1/H/H/1 Impedance Controller Board
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12 Layers HDI PCB（Serpentine trace/0.2mm BGA）
Material: FR-4 370HR TG180 Finish treatment: ENIG 2U″ Copper thickness: 1/1/1/1/1/1/1/1/1/1/1/1 Molding method: CNC+V-Cut Minimum BGA pitch: 0.2mm
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6 Layers HDI 0.3mm BGA, ENIG 2U''
Material: FR-4 TG170 Finish treatment: ENIG 2U″ Copper thickness: 1/1/1/1/1/1 Via-in-Pad + Serpentine Trace Design, Flying Probe Test, Copper hole 25UM
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8 Layers HDI board+segmented gold fingers
HDI can make product design more miniaturized and meet higher electronic performance Minimum hole diameter: 0.125mm Line width: 3mil
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10 Layers HDI high-stability PCB 1.6mm thickness ENIG
HDI can make product design more miniaturized and meet higher electronic performance Material: FR-4 S1000-2M TG180 Finish treatment: Immersion Gold Copper thickness: 1/1/1/1/1/1/1/1/1/1 Surface Treatment: Immersion Gold Solder mask thickness: 25μm
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