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18L HDI lead-free HASL + blind and buried vias
Material: FR-4 S1000-2M TG170 Finish treatment: lead-free HASL Copper thickness: 1/H/H/H/H/H/H/H/H/1/1/1/1/1/1/H/H/1 Impedance Controller Board
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12L HDI PCB（Serpentine trace/0.2mm BGA）
Material: FR-4 370HR TG180 Finish treatment: ENIG 2U″ Copper thickness: 1/1/1/1/1/1/1/1/1/1/1/1 Molding method: CNC + V-Cut Minimum BGA pitch: 0.2mm
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6L HDI 0.3mm BGA, ENIG 2U''
Material: FR-4 TG170 Finish treatment: ENIG 2U″ Copper thickness: 1/1/1/1/1/1 Via-in-Pad + Serpentine Trace Design, Flying Probe Test, IPC class 2, Copper hole 25UM
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8L HDI board + segmented gold fingers
HDI can make product design more miniaturized and meet higher electronic performance Minimum hole diameter: 0.125mm Line width: 3mil
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