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PCB assembly

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Military-Grade Precision

  • IPC-A-610 certified materials
  • Siemens SX series placement machine
  • 10+ years of experience engineer team

72hr Expedited Ecosystem

  • Online Quote in Minutes
  • Smart Production Scheduling System
  • Expedited DHL Delivery within 2-4 Days

Zero-Cost Optimization

  • Highly Automated, Lower Cost
  • FREE Stencil and Set-up & Tooling
  • Incremental Deductions with More Orders

24/7 Customer Service

  • 200+ certified suppliers
  • 7*24 Online Customer Service
  • Localized language technical support <48hr

Production Process

APPLICATIONS INVOLVE INDUSTRIAL
Customer Material Receiving

Customer material receiving for HYCXPCBA involves a process of verifying incoming components and materials provided by the customer to ensure they meet the required specifications for assembly. This includes checking for correct part numbers, quantities, and physical condition, as well as verifying that the materials are compatible with the assembly process.

MES Work Order Creation

MES systems streamline the entire production process, from initial planning to final product release, by managing work orders, tracking materials, and ensuring quality control. The creation of a work order within the MES essentially initiates a production job, detailing the specific tasks, required materials, resources, and deadlines for manufacturing a particular PCBA.

APPLICATIONS INVOLVE INDUSTRIAL
Incoming Quality Control

Incoming Quality Control (IQC) in PCBA (Printed Circuit Board Assembly) is a critical process that involves inspecting and verifying the quality of raw materials, components, and auxiliary materials before they are used in the production line. This ensures that only high-quality components are used in the assembly process, minimizing the risk of defects and errors later on.

Pre-Production Review

Pre-Production Review focuses on validating design accuracy and manufacturability. This includes reviewing Gerber files, verifying drill patterns, stack-up configurations, and ensuring compliance with industry standards.

APPLICATIONS INVOLVE INDUSTRIAL
Component Placement

Each component is picked from its packaging using either a vacuum or gripper nozzle, checked by the vision system and placed in the programed location at high speed.

There is a large variety of machines available for this process and it depends greatly on the business to what type of machine is selected. For example if the business is focused around large build quantities then the placement rate will be important however if the focus is small batch/high mix then flexibility will be more important.

First Article Inspection

First Article Inspection (FAI) in PCBA is a crucial quality control process. It involves a thorough examination of the first PCBA produced from a new design or process, ensuring it meets all design specifications and quality standards before mass production. This process helps identify potential issues early on, preventing costly errors and delays during full-scale production.

APPLICATIONS INVOLVE INDUSTRIAL
Pre-Reflow AOl

Following the component placement process it is important to verify that no mistakes have been made and that all parts have been correctly placed before reflow soldering. The best way of doing this is by using an AOI machine to make checks such as component presence, type/value and polarity.

Reflow Profile Testing

Reflow profile testing in PCBA (Printed Circuit Board Assembly) is the process of optimizing the temperature and time settings during the reflow soldering process to ensure reliable solder joints while preventing damage to components and the PCB. This involves carefully monitoring and adjusting the reflow oven's temperature zones (preheat, soak, reflow, and cooling) to achieve the desired thermal profile for the specific assembly.

APPLICATIONS INVOLVE INDUSTRIAL
Solder Paste Printing

Solder paste printing is a crucial step in PCB assembly, where a precisely measured amount of solder paste is applied to the PCB pads before component placement. This process uses a stencil and squeegee to deposit the solder paste onto the pads. The quality of solder paste printing significantly impacts the reliability of the final soldered joints.

SPI

Solder paste inspection (SPI) is a crucial quality control process in PCBA (Printed Circuit Board Assembly) manufacturing, ensuring the correct application of solder paste before components are placed and soldered. SPI machines use 3D imaging and other technologies to verify the volume, height, shape, and placement of solder paste on the PCB, catching defects early in the process.

APPLICATIONS INVOLVE INDUSTRIAL
Reflow Soldering

Once the components are placed on the boards, each piece is sent through our reflow machines. This means the solder paste needs to solidify, adhering components to the board. PCB assembly accomplishes this through a process called "reflow".

When using lead-free solder a carefully profiled assembly is even more important as the required reflow temperature can often be very close to many components maximum rated temperature.

Post-Reflow Automated Optical Inspection (AOI)

The last part of the surface mount assembly process is to again check that no mistakes have been made by using an AOI machine to check solder joint quality.

The last part of the surface mount assembly process is to again check that no mistakes have been made by using an AOI machine to check solder joint quality.

APPLICATIONS INVOLVE INDUSTRIAL
OQC

HYCXPCBA strictly implements OQC inspection to ensure that each PCBA meets the high standards of customers.

OQC inspection includes 100% X-RAY inspection, functional testing, full appearance inspection, environmental protection and reliability verification, etc., which is the "last mile" of quality.

Through-Hole Insertion

Through-hole insertion in PCB assembly is a technique where component leads are inserted into pre-drilled holes on a printed circuit board and then soldered to the opposite side. This creates a robust mechanical and electrical connection, making it suitable for components that require high reliability or endure stress.

While surface-mount technology (SMT) has become more prevalent, through-hole assembly remains relevant, particularly in applications like prototyping, small-batch production, and industries with high mechanical or thermal stress.

APPLICATIONS INVOLVE INDUSTRIAL
FQC (Final Quality Control)

FQC (Final Quality Control) in PCBA (Printed Circuit Board Assembly) is the final inspection stage before shipping, ensuring the assembled boards meet quality standards and customer requirements. It involves various tests and checks to identify any defects or issues before the product reaches the customer

Packing and Shipping

All assembled circuit boards are carefully packed and shipped via couriers such as DHL, FedEx, UPS, EMS, etc. Any unused components are returned upon customer request. In addition, customers will receive an email notification once the package has been shipped.

APPLICATIONS INVOLVE INDUSTRIAL

Competitive Capabilities

PCB Assembly Requirement

No. Types Of Assembly File Format Component Footprint Component Package Testing Procedures Procedures Others
1 SMT ASSEMBLY Gerber RS-274X 0201,0402,0603... Reels Package Visual Inspection Lead-Free(Rohs) Custom Reflow Profile
2 SMT & THT Assembly BOM(.xls,.csv,.xlsx) BGA,QFN,QFP,PLCC Cut Tape Package X-Ray Inspection Leaded Solder Standard Reflow Profile
3 2 sided STM,THT Assembly Pick-N-Place/XY file SOIC,POP... Tube and Tray AOI,ICT(In-Circuit Test) Reflow Soldering Smallest Size:50x50mm
4 Mixed Assembly —— Small Pitch of 8 Mils Loose Parts and Bulk Functional Testing Wave Soldering Largest Size:1200*460mm
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