12L HDI PCB(Serpentine trace/0.2mm BGA)

原图
Material: FR-4 370HR TG180
Finish treatment: ENIG 2U″
Copper thickness: 1/1/1/1/1/1/1/1/1/1/1/1
Molding method: CNC + V-Cut
Minimum BGA pitch: 0.2mm
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Product Details

Professional PCB Service

Independent PCB Fab: Lowest Total Cost · Fastest Delivery

Accelerate market wins: Optimized PCB production cost & speed


High-quality PCBs Display

Our state-of-the-art facilities and experienced engineering team ensure the highest quality PCBs for you.

Advanced Equipment

Advanced Equipment to ensure product quality

High-quality Raw Materials

Select the top brands in the industry

Fast Turnaround

Prototype to production in as little as 24 hours

Quality Assurance

Rigorous testing at every production stage

PCB manufacturing Process

Product Specifications

Category Details
Board Types Single-Sided, Double-Sided, Multi-Layer, HDI, Rigid-Flex
Materials FR-4, High-Tg FR-4, Rogers, Polyimide, Ceramic, Aluminum
Layers 1-32 Layers (up to 40 layers for special applications)
Maximum Board Size 600mm × 500mm (23.6" × 19.7")
Minimum Trace/Space 3/3 mil (HDI: 2/2 mil)
Surface Finish HASL, ENIG, Immersion Silver, Immersion Tin, OSP, ENEPIG
Minimum Hole Size 0.15mm (mechanical), 0.10mm (laser)
Solder Mask Green, Red, Blue, Black, White, Yellow (LPI)
Copper Weight 0.5oz-6oz (17.5μm-210μm)
Quality Standards IPC-A-600 Class 2/3, ISO 9001:2015, RoHS, UL

Why Choose HYCXPCBA ?

Quality Excellence

Our commitment to quality is unmatched. With rigorous testing protocols and continuous improvement processes, we ensure every PCB meets the highest standards.

Advanced Technology

We invest in the latest SMT equipment, automated optical inspection systems, and precision assembly tools to deliver superior results.

Expert Support

Our engineering team provides design for manufacturability feedback and technical support throughout your project lifecycle.

Global Reach

With facilities in key locations worldwide, we serve customers across North America, Europe, and Asia with consistent quality and service.

PCB Manufacturing Capabilities

Capability Details
HDI Technology Microvias, Stacked Vias, Blind/Buried Vias, Any Layer Interconnect
High-Frequency Boards Low Dk/Df materials, Controlled Impedance (±5%), Signal Integrity Optimization
Heavy Copper PCBs Up to 20oz copper thickness for high-current applications
Rigid-Flex PCBs Dynamic flex circuits, Multi-layer rigid-flex designs
Advanced Surface Finishes ENEPIG, Hard Gold, Selective Gold, Immersion Silver
Controlled Impedance Up to ±3% tolerance for critical high-speed designs
Laser Drilling Micro-vias down to 0.075mm diameter
Via Filling Conductive and non-conductive epoxy, copper filling

PCB Applications

Consumer Electronics

Consumer Electronics

Smartphones, wearables, home automation systems, and entertainment devices.

Medical Devices

Medical Devices

Diagnostic equipment, patient monitoring systems, and implantable devices.

Industrial Automation

Industrial Automation

Control systems, sensors, robotics, and manufacturing equipment.

Automotive Electronics

Automotive Electronics

ADAS systems, infotainment, engine control units, and EV components.

Communication Equipments

Communication Equipments

5G infrastructure, base stations, routers, switches, and networking hardware requiring high-frequency PCBs.

Aerospace Industry

Aerospace Industry

Avionics, satellite systems, flight controllers, and communication equipment requiring high-reliability PCBs.

Ready to Start Your Project?

Our team of experts is ready to help you with your PCB needs. Get a free quote today and experience the HYCX difference.

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