RAK3172 WisDuo LoRaWAN Module Datasheet

Overview

Description

The RAK3172 is a low-power, long-range transceiver module based on the STM32WLE5CC chip. It offers an easy-to-use, compact, and low-power solution for long-range wireless data applications. This module complies with Class A, B, and C of the LoRaWAN 1.0.3 specifications. It can effortlessly connect to various LoRaWAN server platforms, including TheThingsNetwork (TTN), Chirpstack, Actility, etc. Additionally, it supports LoRa Point-to-Point (P2P) communication mode, enabling the rapid implementation of customized long-range LoRa networks.

You can configure the module's mode and operation using AT commands via a UART interface. RAK3172 also offers low-power features, making it well-suited for battery-powered applications.

Features

• Based on STM32WLE5CCU6
• LoRaWAN 1.0.3 specification compliant
• Supported bands: EU433, CN470, IN865, EU868, AU915, US915, KR920, RU864, and AS923-1/2/3/4
• LoRaWAN activation via OTAA/ABP
• LoRa Point-to-Point (P2P) communication
• Custom firmware using Arduino via RUI3 API
• Easy to use AT command set via UART interface
• Long-range - greater than 15 km with optimized antenna
• ARM Cortex-M4 32-bit
• 256 kbytes flash memory with ECC
• 64 kbytes RAM
• Ultra-low-power consumption of 1.69 μA in sleep mode
• Supply Voltage: 2.0 V ~ 3.6 V
• Temperature Range:
  • RAK3172: -20° C ~ 85° C

  
  

  • RAK3172-T: -40° C ~ 85° C

  
  

  
  

• Specifications

  This section covers the hardware and software specifications of the RAK3172. Also, it includes the block diagram and an updated firmware link for the RAK3172 WisDuo Module.

  Hardware

  The hardware specification discusses the interfaces, pinouts, and their corresponding functions and diagrams. It also covers the parameters of both RAK3172 modules in terms of RF, electrical, mechanical, and operating characteristics.

  Interfaces

  Module	Interfaces
  RAK3172	UART2/LPUART1, UART1

  Sub-GHz SPI interface

  A dedicated internal SPI interface called SUBGHZSPI is used to communicate with the RF subsystem of the STM32WLE5CCU6.

  Pin Definition

  Figure 2: Board Pinout for RAK3172
  warning

  When using RF pin for antenna and not the IPEX connector variant, there are design considerations to make sure optimum RF performance.

  • RF traces must be away from interference (switching nodes of DC-DC supplies, high current/voltage pulses from controllers of inductive loads like motors, signal generators, etc.).
  • RF traces must have 50 Ohm impedance. It is advisable to use impedance simulation software tools to achieve this requirement.
  • If using an external antenna connector, place it close to the RF pin.
  • Ground plane optimization is critical for certain antenna types, such as monopoles.
  • GND traces used for RF path return must be directly connected to the GND plane and not treated as thermal reliefs.
  • It is recommended that RF traces be routed in a curve rather than at a sharp 90 degrees.

  
  

  Pin No.	Name	Type	Description
  1	PA3/UART2_RX	I	Reserved - UART2/LPUART1 Interface (AT Commands and FW Update)
  2	PA2/UART2_TX	O	Reserved - UART2/LPUART1 Interface (AT Commands and FW Update)
  3	PA15/PIN_A4	I/O	GPIO and ADC
  4	PB6/UART1_TX	O	UART1 Interface
  5	PB7/UART1_RX	I	UART1 Interface
  6	PA1	I/O	GPIO only
  7	PA13/SWDIO		Reserved - SWD debug pin (SWDIO)
  8	PA14/SWCLK		Reserved - SWD debug pin (SWCLK)
  9	PA12/I2C_SCL	I/O	GPIO and I2C (SCL)
  10	PA11/I2C_SDA	I/O	GPIO and I2C (SDA)
  11	GND		Ground connections
  12	RF		RF Port (only available on RAK3172 No-IPEX connector variant)
  13	PA7/SPI1_MOSI	I/O	GPIO and SPI (MOSI)
  14	PA6/SPI1_MISO	I/O	GPIO and SPI (MISO)
  15	PA5/SPI1_CLK	I/O	GPIO and SPI (CLK)
  16	PA4/SPI1_NSS	I/O	GPIO and SPI (NSS)
  17	GND		Ground connections
  18	GND		Ground connections
  19	PA8	I/O	GPIO only
  20	PA9	I/O	GPIO only
  21	BOOT0		Boot0 mode enable pin - high active
  22	RST		MCU Reset (NRST)
  23	GND		Ground connections
  24	VDD		VDD - Voltage Supply
  25	PA10/PIN_A3	I/O	GPIO and ADC
  26	PB2/PIN_A2	I/O	GPIO and ADC
  27	PB12	I/O	10 kΩ internally pulled-up for high freq variant or pulled-down for low freq variant
  28	GND		Ground connections
  29	PA0	I/O	GPIO only
  30	PB5	I/O	GPIO only
  31	PB4/PIN_A1	I/O	GPIO and ADC
  32	PB3/PIN_A0	I/O	GPIO and ADC

  RF Characteristics

  The RAK3172 supports two different frequency variations: RAK3172(L) Low Radio Frequency and RAK3172(H) High Radio Frequency.

  
  

  Operating Frequencies

  Module	Region	Frequency
  RAK3172(L)	Europe	EU433
  	China	CN470
  RAK3172(H)	Europe	EU868
  	North America	US915
  	Australia	AU915
  	Korea	KR920
  	Asia	AS923-1/2/3/4
  	India	IN865
  	Russia	RU864

  Electrical Characteristics

  Operating Voltage

  Feature	Minimum	Typical	Maximum	Unit
  VCC	2.0	3.3	3.6	Volts (V)

  Operating Current

  Feature	Condition	Minimum	Typical	Maximum	Unit
  Operating Current	TX Mode	87 (@ 20 dBm 868 Mhz)			mA
  	RX Mode	5.22			mA

  Sleep Current

  Feature	Condition	Minimum (2.1 V)	Typical (3.3 V)	Maximum	Unit
  Current Consumption	EU868	-	1.69	-	μA
  	US915	-	1.69	-	μA
  	CN470	-	1.69	-	μA

  
  

  Mechanical Characteristics

  Module Dimensions

  Figure 3: RAK3172 Physical Dimension

  Layout Recommendation

  Figure 4: RAK3172 Layout

  Environmental Characteristics

  Operating Temperature

  Module	Minimum	Typical	Maximum	Unit
  RAK3172	-20	25	85	° C
  RAK3172-T	-40	25	85	° C

  Storage Temperature

  Feature	Minimum	Typical	Maximum	Unit
  Storage Temperature	-40		85	° C

  Recommended Reflow Profile

  Figure 5: Reflow Profile for RAK3172

  Standard conditions for reflow soldering:

  • Pre-heating Ramp (A) (Initial temperature: 150° C): 1~2.5° C/sec
  • Soaking Time (T2) (150~180° C): 60~100 sec
  • Peak Temperature (G): 230~250° C
  • Reflow Time (T3) (> 220° C): 30~60 sec
  • Ramp-up Rate (B): 0~2.5° C/sec
  • Ramp-down Rate (C): 1~3° C/sec

  Software

  Download the latest RAK3172 WisDuo LoRaWAN Module firmware provided below. The RAK3172(L) and RAK3172(H) use the same firmware, and it will automatically detect the variant of the module being used.

  The bin file contains only the application code. You will need the RAK DFU Tool to upload this file to the module.